Low temperature calcium silicate board

Microcellular calcium silicate board

2024-11-08 14:18:56 18

Product Details

Product

Microcellular calcium silicate board, also known as modified calcium silicate board, is a new type of insulation material produced by high-temperature and high-pressure hydrothermal reaction of inorganic silicon-based materials and calcium-based materials. It has light weight, high strength, environmental friendliness, and energy saving advantages, and is currently one of the most highly regarded green building materials on the market.

Features

1 Lightweight and High Strength: Microcellular calcium silicate board has a low density, but its compressive and bending strength is high, making it one of the strongest insulation materials among inorganic rigid thermal insulation materials.

2 Excellent Thermal Insulation: Its low thermal conductivity provides excellent thermal insulation, reducing energy consumption and improving energy efficiency.

3 Fire Safety: Its fire rating is A level, non-toxic, and non-flammable, making it safe and environmentally friendly.

4 High Water Repellency: Its water repellency rate is as high as 98%, making it difficult to absorb water even in humid environments, and maintaining its performance stability.

5 Resistance to High and Low Temperatures: It can withstand temperatures ranging from 650 degrees Celsius to -450 degrees Celsius, and does not deform within its usable temperature range.

6 Environmentally Friendly without Pollution: It contains no asbestos and does not release harmful substances, meeting environmental requirements.

Application 

Microcellular calcium silicate board is widely used for roof insulation and exterior wall insulation in buildings, as well as for thermal insulation of equipment and pipelines in the petroleum, chemical, and metallurgical industries. 

650C CALCIUM SILICATE PIPE

ltems

Unit

FH-220

GB/T10699—2015

ASTM-C533

Density

kg/m³

220±10%

220±10%

≤240

Pressure Strength

Mpa

≥0.7

≥0.5

≥0.688

Flexural Strength

Mpa

≥0.45

≥0.3

≥0.344

Thermal

Conductivity

93℃

W/(m.K)

≤0.056

≤0.065

≤0.065

149℃

≤0.062

≤0.072

≤0.072

260℃

≤0.074

≤0.087

≤0.087

371℃

≤0.086

≤0.102

s0.102

538℃

≤0.104

≤0.111

≤0.111

Temp.Limit

650

650

650

Linear Shrinkage

%

≤2(650℃,12Hrs)

≤2(650℃,12Hrs)

≤2(650℃,12Hrs)

Length mm

(±4mm)

Width mm

(±3mm)

Thickness mm

(+3,-1.5mm)

600

300

25-120

500

500

25-120


 


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